Epoksidna smola dvokomponentna 149 100gr.

Opis

Epoxy Potting Compound 149 is a two-component encapsulation material designed for potting and hermetizing electronic, telecommunications, and radio components. With excellent electro-insulating properties and exceptional adhesion to a wide range of materials, this product ensures reliable protection in demanding conditions. Its versatility makes it ideal for use in advanced industrial projects as well as in smaller electronics applications.

Epoxy Potting Compound 149 is designed to meet the needs of a wide range of applications in electronics and electrotechnics. It can be used for potting coils, transformers, capacitors, resistors, connectors, and cable ends, as well as for hermetizing electrical devices. It works perfectly as an insulation and structural material, maintaining its properties even in challenging temperature and atmospheric conditions.

Our Epoxy 149 is exceptionally easy to use, making it an ideal choice for both professionals and less experienced users. Its easy mixing and quick curing make the application process convenient and efficient.

Surfaces intended for potting should be properly prepared. They should be cleaned of all mechanical contaminants, e.g., using sandpaper, and then degreased (e.g., with acetone). For metals, chemical etching in a suitable bath may be used.

The components of Epoxy Potting Compound 149 (potting resin and hardener) should be mixed at room temperature in the following ratio: 100 parts by weight of Epoxy 149 and 12 parts by weight of the hardener. It is important to mix the components thoroughly until a homogeneous mass is obtained. It is recommended to prepare small amounts of the mixture that will be used within a few minutes to avoid curing issues.

Curing of Epoxy Potting Compound 149 can be carried out at room temperature. After curing, the product has a light yellow color. The process takes 7 days for full mechanical strength and 14 days for chemical resistance. To avoid curing leftover resin on tools, it is recommended to clean application equipment promptly using a solvent, such as acetone.