Silikonska pasta AG Copper špric 14ml.

Opis

Thermal Paste Copper is enriched with copper compounds, providing a thermal conductivity of ~3.1 W/mK. This effectively dissipates heat, which is crucial for the optimal performance of your equipment. The copper color of the paste visually highlights its advanced technology.

Ideal for filling micro-inequalities between contacting elements, such as the processor and radiator. It also performs excellently in cooling power systems like converters, motor controllers, and power amplifiers. Its universal application makes it indispensable in computers and advanced electronic systems.

Thermal Paste Copper minimizes thermal resistance, resulting in better cooling and extended lifespan of electronic components. It operates effectively over a wide temperature range from -50°C to 250°C, and temporarily up to 340°C. It is perfect for applications requiring high reliability in extreme conditions.

Copper has a density of ~2.9 g/cm³ at 20°C and does not evaporate, ensuring long-lasting effectiveness. Its viscosity prevents it from flowing, and a thixotropic index of 380 ± 10 allows for easy application.

The specific cross-resistance is 3.8 x 10¹⁴ Ohm x cm, providing excellent electrical insulation. The dielectric loss factor tg δ at f=120 Hz is 0.013, and the relative dielectric constant εr at f=120 Hz is 13.6, further emphasizing its advanced dielectric properties.