Fluks tečni AC81 100ml.

Opis

Flux AC81/N is characterized by exceptionally high chemical activity. It effectively prepares surfaces for soldering by removing oxides and other contaminants. It enables quick and reliable bonding of components, ensuring excellent wetting of soldered surfaces. With a density of 0.83 g/cm³ and a viscosity of 23 cP at 20°C, it is highly efficient yet easy to apply.

Flux AC81/N is designed for a wide range of applications in soldering printed circuit boards and SMD components. It is ideal for applying liquid tin-lead alloy (Sn60/Pb) onto PCBs in roll tinning machines. Its versatility makes it suitable for both small workshops and large production lines, where precision and process consistency are crucial.

Flux AC81/N meets strict quality requirements, as confirmed by numerous certifications. The product complies with ISO 9454 type 2124 and J-STD-004 ORH1 standards, attesting to its high quality and reliability. It is a solution that allows for professional and safe soldering even in the most demanding conditions. Does not contain colophony.

After completing the work, simply rinse the soldered area with warm (around 50°C) deionized water, using a soft antistatic brush to remove residues. Then rinse the cleaned area with cold water to remove any remaining deposits and prevent residue build-up. For better results, use a Water PCB cleaner, which is more effective than ordinary deionized water—preventing corrosion and contamination on soldered components.